Secondary battery model HILS implementation method by Bee Technologies

 This paper describes a method for simulating SPICE models of secondary batteries, such as lithium-ion, lead-acid, and solid-state batteries, in real time in a hardware-in-the-loop simulation (HILS) environment. It details the process of deriving a state-space model from a SPICE equivalent circuit model and converting it into real-time executable difference equations. It then explains how to implement the model using an FPGA or microcontroller, converting it to fixed-point arithmetic, and ensuring real-time performance on the order of microseconds. It also touches on the design of a high-speed power output stage (power amplifier) for connecting to target devices such as battery management systems (BMS) and inverters, and techniques for accurately reproducing transient responses. Finally, it introduces existing battery HILS products from companies such as A&D and OPAL-RT, as well as similar examples from academic research, emphasizing the importance of development and verification in a safe and flexible environment.

Bee Technologies: Model-based development and SPICE usage examples

This article provides an overview of Bee Technologies, a company focused on device modeling and simulation technology. Services offered include SPICE and MATLAB model development, model validation, and circuit diagram symbol creation. It also reports on the release of the latest models for LiFePO4 and solid-state batteries, and introduces device modeling examples for motor drive ICs and stepping motors. The website offers numerous SPICE models through "Spice Park," as well as technical documents and seminar information for circuit designers and general users.

The Hidden Details Inside a Tech Design Review(about ZED-X20P) by Bee Technologies

 The Hidden Details Inside a Tech Design Review(about ZED-X20P)

It details the results of the ZED-X20P design review and provides specific recommendations and warnings related to power, RF, V_Backup, USB, I2C/SPI, RESET_N, Safe Boot, and shielding. This includes component replacements, wiring instructions, and design considerations to ensure optimal performance and reliability. In particular, there is an important notice that the USB interface is not fully compliant with industry standards and is therefore not suitable for mass production. Overall, this document provides detailed technical guidance for addressing potential issues in module design and integration.